Click Here to see the project from the beginning
As I get closer to having everything working to my satisfaction, I’m beginning to look ahead to make the project reproducible by others. An obstacle for many might be that I use SMD components extensively, and many builders might have issues there. Therefore, before the next round of PCB redesign, I am modifying all the component PCB patterns so that either thru-hole or SMD components can be used. For all the common components such as resistors and capacitors, I have a new PCB pattern that looks like this:

This pattern will accept SMD hand-soldered components up to 1210, thru-hole 1/4W resistors on-end, or thru-hole capacitors with lead spacing up to 0.15″. I understand that it is not a recommended practice to put holes in SMD pads if the board is to be machine soldered, but I doubt if anyone will do that.
I intend to incorporate provision for SOIC-to-DIP adapters (below) into any redesigns so that the builder can solder DIP’s and SOIC IC’s directly to the main board or use the adapter board to simulate a DIP. With the DIP option you can socket the IC, which is useful during prototyping and debugging. I intend to post all the schematics, the PCB Gerber files and Digikey/Mouser part numbers as well as instructions for how to order custom PCB boards really cheap.

My first redesign will probably be the QSD detector board, as I’m not totally satisfied with the circuit architecture I chose there. I hope I can fit everything with the new larger patterns. Next will be the PSN/filter board and so on. I intend to make all the board outlines the same so they can be packaged in the little tins I used for the QSD.

Stay tuned.